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 ICS2309
3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Description
The ICS2309 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on ICS' proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides eight low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The ICS2309 is available in two different versions. The ICS2309-1 is the base part. The ICS2309-1H is a high drive version with faster rise and fall times.
Features
* * * * * * * * * * *
Clock outputs from 10 to 133 MHz Zero input-output delay Eight low skew (<250 ps) outputs Device-to-device skew <700 ps Full CMOS outputs with 25 mA output drive capability at TTL levels 5 V tolerant CLKIN Tri-state mode for board-level testing Advanced, low power, sub-micron CMOS process Operating voltage of 3.3 V Industrial temperature range available Packaged in 16-pin SOIC and TSSOP (-1H version only) (16-pin TSSOP only)
* Pb (lead) free package available for -1H version
Block Diagram
VDD 2
CLKIN
PLL
0 CLKOUT 1 CLKA1 CLKA2 CLKA3 CLKA4
S2, S1 2
Control Logic
CLKB1 CLKB2 CLKB3 CLKB4 GND 2
MDS 2309 D I n t e gra te d C i r c u i t S y s te m s
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52 5 Ra ce Street, San Jose, CA 9 512 6
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Pin Assignment
CLKIN CLKA1 CLKA2 VDD GND CLKB1 CLKB2 S2 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 CLKOUT CLKA4 CLKA3 VDD GND CLKB4 CLKB3 S1
16 pin narrow (150 mil) SOIC
Output Clock Mode Select Table
S2 0 0 1 1 S1 0 1 0 1 CLKA1:A4 Tri-state (note 1) Running Running Running CLKB1:B4 Tri-state (note 1) Tri-state (note 1) Running Running A & B Source PLL PLL CLKIN (note 2) PLL PLL Status OFF ON OFF ON
Note 1. Outputs are in high impedance state Note 2. Buffer mode only; not zero delay between input and output
Pin Descriptions
Pin Number 1 2-3 4 5 6-7 8 9 10 - 11 12 13 14 - 15 16 Pin Name CLKIN CLKA1:A4 VDD GND CLKB1:B4 S2 S1 CLKB1:B4 GND VDD CLKA1:A4 CLKOUT Pin Type Input Output Power Power Output Input Input Output Power Power Output Input Clock input (5 V tolerant). Clock outputs A1:A4. See table above. Power supply. Connect to 3.3 V. Connect to ground. Clock outputs B1:B4. See table above. Select input 2. See table above. Internal pull-up. Select input 1. See table above. Internal pull-up. Clock outputs B1:B4. See table above. Connect to ground. Power supply. Connect to 3.3 V. Clock outputs A1:A4. See table above. Buffered output. Internall feedback on this pin. Pin Description
MDS 2309 D In te grated Circuit Systems
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
External Components
The ICS2309 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.01 mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as close to the device as possible. A series termination resistor of 33 may be used to each clock output pin to reduce reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS2309. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.
Item
Supply Voltage, VDD All Inputs and Outputs CLKIN and FBIN inputs Electrostatic Discharge (HBM) Ambient Operating Temperature (Commercial) Ambient Operating Temperature (Industrial) Storage Temperature Junction Temperature Soldering Temperature 7V
Rating
-0.5 V to VDD+0.5 V -0.5 V to 5.5 V 2000 V 0 to +70C -40 to +85C -65 to +150C 150C 260C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature (Industrial) Ambient Operating Temperature (Commercial) Power Supply Voltage (measured in respect to GND)
Min.
-40 0 +3.0
Typ.
Max.
+85 +70 +3.6
Units
C C V
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
DC Electrical Characteristics
ICS2309M-1, VDD = 3.3 V 10%, Ambient Temperature -40 to +85C(Industrial), (0-70C Commercial)
Parameter
Operating Voltage Input High Voltage Input Low Voltage Input Low Current Input High Current Output High Voltage Output Low Voltage Operating Supply Current Power Down Supply Current Short Circuit Current Input Capacitance
Symbol
VDD VIH VIL IIL IIH VOH VOL IDD
Conditions
Min.
3.0 2
Typ.
Max.
3.6 0.8
Units
V V V A A V V mA A mA pF
VIN = 0V VIN = VDD IOH = -12 mA IOL = 12 mA No Load CLKIN = 0, Note 1 2.4
50 100 0.4 32 12 50 5
IOS CIN
Each output S2, S1, CLKIN
Note 1: When there is no clock signal present at CLKIN, the ICS2309 will enter power down mode. The PLL is stopped and the outputs are tri-state.
AC Electrical Characteristics
ICS2309M-1, VDD=3.3 V 10%, Ambient temperature -40 to +85C(Industrial), (0-70C Commercial),
Parameter
Output Clock Frequency Output Clock Frequency Output Rise Time Output Fall Time Output Clock Duty Cycle Output Clock Duty Cycle Device to Device Skew Output to Output Skew Input to Output Skew Input to Output Skew Cycle to Cycle Jitter PLL Lock Time
Symbol
fIN tOR tOF tDC tDC
Conditions
10 pF load, See table on page 2 30 pF load, See table on page 2 0.8 to 2.0 V, outputs loaded 2.0 to 0.8 V, outputs loaded measured at 1.4V, Fout=66.67 MHz measured at 1.4V, Fout=50 MHz rising edges at VDD/2 rising edges at VDD/2 rising edges at VDD/2 rising edges at VDD/2, S2= 1, S1 = 0 measured at 66.67M, outputs loaded Note 2
Min.
10 10
Typ.
Max. Units
133 100 2.5 2.5 MHz MHz ns ns % % ps ps ns ns ps ms
40 45
50 50
60 55 700 250 350
1
5
8.7 200 1.0
Note 2: With VDD at a steady rate and valid input at CLKIN
MDS 2309 D In te grated Circuit Systems
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
ICS2309M-1H, VDD=3.3 V 10%, Ambient temperature -40 to +85C(Industrial), (0-70C Commercial),
Parameter
Output Clock Frequency Output Clock Frequency Output Rise Time Output Fall Time Output Clock Duty Cycle Output Clock Duty Cycle Device to Device Skew Output to Output Skew Input to Output Skew Input to Output Skew Cycle to Cycle Jitter PLL Lock Time
Symbol
fIN tOR tOF tDC tDC
Conditions
10 pF load, See table on page 2 30 pF load, See table on page 2 0.8 to 2.0 V, outputs loaded 2.0 to 0.8 V, outputs loaded measured at 1.4V, Fout=66.67 MHz measured at 1.4V, Fout=50 MHz rising edges at VDD/2 rising edges at VDD/2 rising edges at VDD/2 rising edges at VDD/2, S2= 1, S1 = 0 measured at 66.67M, outputs loaded Note 3
Min.
10 10
Typ.
Max. Units
133 100 1.5 1.5 MHz MHz ns ns % % ps ps ps ns ps ms
40 45
50 50
60 55 700 250 350
1
5
8.7 200 1.0
Note 3: With VDD at a steady rate and valid input at CLKIN
MDS 2309 D In te grated Circuit Systems
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)
Package dimensions are kept current with JEDEC Publication No. 95
16
Millimeters Symbol Min Max
Inches Min Max
E1 INDEX AREA
E
12 D
A A1 A2 b C D E E1 e L
-1.20 0.05 0.15 0.80 1.05 0.19 0.30 0.09 0.20 4.90 5.1 6.40 BASIC 4.30 4.50 0.65 Basic 0.45 0.75 0 8
-0.047 0.002 0.006 0.032 0.041 0.007 0.012 0.0035 0.008 0.193 0.201 0.252 BASIC 0.169 0.177 0.0256 Basic 0.018 0.030 0 8
A 2 A 1
A
c
-Ce
b SEATING PLANE L
.10 (.004)
C
Thermal Characteristics for 16TSSOP
Parameter
Thermal Resistance Junction to Ambient
Symbol
JA JA JA JC
Conditions
Still air 1 m/s air flow 3 m/s air flow
Min.
Typ.
78 70 68 37
Max. Units
C/W C/W C/W C/W
Thermal Resistance Junction to Case
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
16
Inches Min Max
Symbol
Min
Max
E INDEX AREA
H
12 D
A A1 B C D E e H h L
h x 45
1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 9.80 10.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0 8
.0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .3859 .3937 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0 8
A A1
C
-Ce
B SEATING PLANE L
.10 (.004)
C
Thermal Characteristics for 16SOIC
Parameter
Thermal Resistance Junction to Ambient
Symbol
JA JA JA JC
Conditions
Still air 1 m/s air flow 3 m/s air flow
Min.
Typ.
120 115 105 58
Max. Units
C/W C/W C/W C/W
Thermal Resistance Junction to Case
MDS 2309 D In te grated Circuit Systems
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5 25 Race Stree t, San Jose, CA 951 26
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
Ordering Information
Part / Order Number
ICS2309MI-1 ICS2309MI-1T ICS2309M-1 ICS2309M-1T ICS2309MI-1H ICS2309MI-1HT ICS2309M-1H ICS2309M-1HT ICS2309GI-1H ICS2309GI-1HT ICS2309GI-1HLF ICS2309GI-1HLFT ICS2309G-1H ICS2309G-1HT ICS2309G-1HLF ICS2309G-1HLFT
Marking
ICS2309MI-1 ICS2309MI-1 ICS2309M-1 ICS2309M-1 ICS2309MI-1H ICS2309MI-1H ICS2309M-1H ICS2309M-1H 2309GI1H 2309GI1H 309GI1HL 309GI1HL 2309G-1H 2309G-1H 2309G1HL 2309G1HL
Shipping Packaging
Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel
Package
16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP
Temperature
-40 to +85 C -40 to +85 C 0 to +70 C 0 to +70 C -40 to +85 C -40 to +85 C 0 to +70 C 0 to +70 C -40 to +85 C -40 to +85 C -40 to +85 C -40 to +85 C 0 to +70 C 0 to +70 C 0 to +70 C 0 to +70 C
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments.
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Revision 052405 te l (40 8) 2 97-12 01
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ICS2309 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER Revision History
Rev.
A B
Originator
P. Griffith P. Griffith
Date
12/01/04 12/27/04
Description of Change
New device/datasheet; Prelminary. Add TSSOP package. Made corrections to IDD, IDDP, input capacitance and duty cycle specs/test conditions. Removed jitter specs for CL=15 pF. Added I/O skew spec for bypass mode and duty cycle spec for Fout=50 MHz. Made corrections to test conditions for output rise time, fall time, duty cycle and cycle-to-cycle jitter. Moved from Preliminary to Final. Added LF ordering info to 16-pin TSSOP (-1H version only); added Thermal Chars for 16-pin TSSOP package
C D
P. Griffith P. Griffith
1/25/05 5/24/05
MDS 2309 D In te grated Circuit Systems
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5 25 Race Stree t, San Jose, CA 951 26
Revision 052405 te l (40 8) 2 97-12 01
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